To provide a flexible printed circuit board in which a solder resist film excellent in bending resistance is formed and a method of manufacturing the same.

In the flexible printed circuit board 1, a solder resist film 16 is formed on part of the top of the board body 2, and in the wall surface of a boundary with a connecting region 8 to which a bending force of the board body 2 may be applied with respect to a boundary between the solder resist film 16 and the board body 2, a slope 20 is formed such that the film becomes thinner to a board body 2 side from the upper surface of the solder resist film 16.