Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT CONDUCTOR
Document Type and Number:
Japanese Patent JP2000247758
Kind Code:
A
Abstract:

To provide a heat conductor which has a relatively low thermal expansion coefficient and excellent heat conductivity by mixing carbon fibers with a metal selected from copper, aluminum, silver and gold to give a heat conductivity of a specific value or larger.

This heat conductor comprises carbon fibers, preferably pitch- based carbon fibers to whose surfaces free carbon is substantially not adhered, and one or more metals selected from copper, aluminum, silver and gold, and has a heat conductivity of ≥300 W/mK. Carbon fibers whose surfaces are plated with nickel are preferable, because the wettability of the metal on the surfaces of the carbon fibers is improved. It is preferable that the direction of the heat conduction is approximately coincident with the longitudinal direction of the carbon fibers. The lamination density of the carbon fibers is preferably controlled to give a thermal expansion coefficient of 4×10-6 to 8×10-6. The heat conductor may be produced by laminating carbon fibers 4 in a constant direction in a vessel having a compressing means, compressing the laminated carbon fibers, immersing the carbon fibers together with the vessel in a melted metal, and then pressing the immersed carbon fibers from the outside to impregnate the metal into spaces among the carbon fibers.


Inventors:
HANZAWA SHIGERU
NAKANO KENJI
Application Number:
JP4905099A
Publication Date:
September 12, 2000
Filing Date:
February 25, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NGK INSULATORS LTD
International Classes:
C04B35/84; C22C47/00; C22C49/00; C22C49/02; C22C49/06; F28F21/02; (IPC1-7): C04B35/84; C22C49/00; C22C49/02; F28F21/02
Attorney, Agent or Firm:
Ippei Watanabe