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Title:
HEAT-DISSIPATING COATING COMPOSITION, HEAT-DISSIPATING COATING FILM, AND COATING FILM FORMATION METHOD
Document Type and Number:
Japanese Patent JP2019073629
Kind Code:
A
Abstract:
To provide a heat-dissipating coating composition and a heat-dissipating coating film which can omit a heat-dissipating filler, and a coating film formation method.SOLUTION: A heat-dissipating coating composition has a structure such that a linear alkyl group having 4 to 16 carbon atoms is bonded to a phenol nucleus of a resol type phenol resin through an ether bond. The heat-dissipating coating composition is produced by dehydration condensation of a resol type phenol resin and primary alcohol having 4 to 16 carbon atoms. The heat-dissipating coating composition forms a heat-dissipating coating film on a surface of a base material.SELECTED DRAWING: Figure 3

Inventors:
YOKOYAMA KAZUTAKA
KODAIRA RYOSUKE
DATEKI KOSUKE
KOBAYASHI TAKANORI
Application Number:
JP2017200726A
Publication Date:
May 16, 2019
Filing Date:
October 17, 2017
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
C09D161/00; C09D7/40
Domestic Patent References:
JPH0953031A1997-02-25
JPH01217081A1989-08-30
JPH107884A1998-01-13
JP2012149161A2012-08-09
JP2013091783A2013-05-16
JP2009123607A2009-06-04
JPH04268381A1992-09-24
Foreign References:
US20100044648A12010-02-25
US20170029550A12017-02-02
Attorney, Agent or Firm:
Patent business corporation Oshima patent office