Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT-DISSIPATING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2009167358
Kind Code:
A
Abstract:

To provide a heat-dissipating resin composition excellent in heat-dissipating property, thermal deformation resistance, toning property, glossiness, impact resistance and flexural strain characteristics, and to provide a molded article containing the same.

The heat-dissipating resin composition comprises polytetramethylene adipamide and boron nitride, wherein the amount of the former and the amount of the latter are 15 to 95 mass% and 5 to 85 mass% (the total amount of both the components is 100 mass%), respectively.


Inventors:
FUJIOKA SHINSUKE
Application Number:
JP2008009733A
Publication Date:
July 30, 2009
Filing Date:
January 18, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TECHNO POLYMER CO LTD
International Classes:
C08L77/00; C08K3/38; H01L33/48; H01L33/58; H01L33/60; H01L33/64
Domestic Patent References:
JP2007294867A2007-11-08
JP2004059638A2004-02-26
JP2002020618A2002-01-23
JP2009167359A2009-07-30
JPH01121361A1989-05-15
JP2007294867A2007-11-08
JPH03263461A1991-11-22
Foreign References:
WO2006112300A12006-10-26
Attorney, Agent or Firm:
Kazuhiko Okada