To provide a heat-dissipating resin composition excellent in heat-dissipating property, thermal deformation resistance, toning property, glossiness, impact resistance and flexural strain characteristics, and to provide a molded article containing the same.

The heat-dissipating resin composition comprises a polyarylene sulfide (A), polytetramethylene adipamide (B), and boron nitride (C), wherein the amounts of the components (A), (B) and (C) are 10 to 90 mass%, 5 to 70 mass%, and 5 to 85 mass% [the total amount of the components (A) to (C) is 100 mass%], respectively.