To provide a vacuum sealing resin and a vacuum device capable of reducing the gas discharge rate quickly to a target ultimate vacuum by baking at the early stage of discharge even if the resin is disposed in vacuum.

The vacuum sealing resin comprises an epoxy resin and a filler blended therewith. The filler is at least one selected from polyolefins, fluororesins, and the mixtures thereof, having a particle size of 0.5 m to 2 mm. The blending ratio of the filler is 30 to 70 Vol%. Further, the vacuum device using the vacuum sealing resin comprises a magnetic material, electric wiring, a coil, an electronic component, an insulating material, or a component obtained by combining them, in a metal frame such as a case or a frame, which is sealed with the vacuum sealing resin.