Title:
HEAT DISSIPATION BOARD
Document Type and Number:
Japanese Patent JP2015109299
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat dissipation board having a metallization layer directly integrated with a base with good adhesiveness.SOLUTION: A heat dissipation board comprises: a base composed of a nitride-based ceramic; and a heat-dissipation layer directly provided on at least one surface of the base, and including copper as a primary component and a glass component. The glass component includes 0.5 mol% or more and 5 mol% or less of AgO which is a composition in terms of oxide.
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Inventors:
TAKAHASHI YOSUKE
KONO TATSUKI
KONO TATSUKI
Application Number:
JP2013250103A
Publication Date:
June 11, 2015
Filing Date:
December 03, 2013
Export Citation:
Assignee:
NORITAKE CO LTD
International Classes:
H01L23/15; C03C3/062; H01L23/12; H01L23/36; H01L23/373
Domestic Patent References:
| JPH03134905A | 1991-06-07 | |||
| JP2007201346A | 2007-08-09 | |||
| JPH0431336A | 1992-02-03 | |||
| JPH0193486A | 1989-04-12 |
Foreign References:
| WO2012020694A1 | 2012-02-16 |
Attorney, Agent or Firm:
Makoto Abe
Michiko Oi
Michiko Oi