Title:
HEAT DISSIPATION DEVICE
Document Type and Number:
Japanese Patent JP2011101005
Kind Code:
A
Abstract:
To provide a heat dissipation device whose assembling process is easy and which has high assembly reliability.
The heat dissipation device includes a radiator and a fixed frame housing the radiator, wherein a plurality of positioning portions are protruded inside the fixed frame, the radiator is stored in the fixed frame, and a plurality of cut portions that the plurality of positioning portions penetrate are formed on a peripheral surface of the radiator, the plurality of positioning members correspond to the plurality of cut portions when the radiator is in a first state, and shift from the cut portions to abut against a bottom portion of the radiator when the radiator is in a second state.
Inventors:
RYU HISASHI
ZHANG JING
ZHANG JING
Application Number:
JP2010242081A
Publication Date:
May 19, 2011
Filing Date:
October 28, 2010
Export Citation:
Assignee:
FUZHUN PREC IND SHENZHEN
KOJUN SEIMITSU KOGYO KOFUN YUGENKOSHI
KOJUN SEIMITSU KOGYO KOFUN YUGENKOSHI
International Classes:
H05K7/20; H01L23/36; H01L23/467
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
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