Title:
放熱部材及び電気接続箱
Document Type and Number:
Japanese Patent JP7127498
Kind Code:
B2
Abstract:
A heat radiating member and an electrical junction box are provided that have a simple configuration and are capable of quickly radiating heat generated by a semiconductor device. A support member, which receives heat from a substrate portion having a mounting face on which a semiconductor device is mounted, via an opposing plate portion opposing the mounting face, and radiates the received heat, includes a recessed portion formed in the opposing plate portion, at a position corresponding to the semiconductor device. The recessed portion has a wall thickness that is greater than that of another portion of the opposing plate portion.
Inventors:
Junya Aichi
Jun Ikeda
Jun Ikeda
Application Number:
JP2018211604A
Publication Date:
August 30, 2022
Filing Date:
November 09, 2018
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
H01L23/36; H02G3/16; H05K7/20
Domestic Patent References:
| JP2009135141A | ||||
| JP2016063064A | ||||
| JP2011130558A | ||||
| JP2016146427A | ||||
| JP2015126095A |
Foreign References:
| WO2010067725A1 |
Attorney, Agent or Firm:
Hidehito Kono
Tono Kono
Tono Kono