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Title:
HEAT FUSION-BONDING PROPYLENE POLYMER LAMINATED FILM AND ITS APPLICATION
Document Type and Number:
Japanese Patent JP2005111857
Kind Code:
A
Abstract:

To provide a heat fusion-bonding propylene polymer laminated film which is excellent in low temperature heat sealing properties at a high speed under a low pressure, lamination strength, blocking resistance, etc., and suitable for packaging material.

In the laminated film, on one side of a heat fusion-bonding layer obtained from a propylene polymer composition (C) of a propylene-α-olefin copolymer (A) in which a peak temperature (Tp) obtained from a crystal fusion curve based on DSC is 110-140°C, and the difference (Te-Ts) between a fusion starting temperature (Ts) and a fusion ending temperature (Te) is below 45°C and an ethylene-α-olefin copolymer (B) having a density of 0.865-910 g/cm3, through an intermediate layer obtained from the copolymer (A), a laminate layer obtained from an olefin polymer composition (E) of a propylene polymer (D) and the ethylene-α-olefin random copolymer (B) is provided.


Inventors:
TAGUCHI EIICHI
Application Number:
JP2003350193A
Publication Date:
April 28, 2005
Filing Date:
October 09, 2003
Export Citation:
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Assignee:
TOHCELLO CO LTD
International Classes:
B65D65/40; B32B27/32; (IPC1-7): B32B27/32; B65D65/40
Domestic Patent References:
JPH11245351A1999-09-14
JPH10180964A1998-07-07
JP2002172744A2002-06-18
JPH10212382A1998-08-11
JP2001260291A2001-09-25