Title:
POLYIMIDE METAL LAMINATE EXCELLENT IN POLYIMIDE ETCHING PROPERTY
Document Type and Number:
Japanese Patent JP2005111858
Kind Code:
A
Abstract:
To provide a polyimide metal laminate in a good shape of etching processing by an alkali solution.
In the polyimide metal laminate, stainless steel foil and metal foil are bonded together through a polyimide layer. In the polyimide layer, a thermoplastic polyimide is formed on both surfaces of a non-thermoplastic polyimide. The thickness of the thermoplastic polyimide is 0.02-0.30 times as large as that of the non-thermoplastic polyimide, and the wet etching speed of the non-thermoplastic polyimide is 0.1-1.5 times as high as that of the thermoplastic polyimide.
Inventors:
TSUDA TAKESHI
HIROTA KOJI
YOKOZAWA SHUICHI
NAKAZAWA OOKI
HIROTA KOJI
YOKOZAWA SHUICHI
NAKAZAWA OOKI
Application Number:
JP2003350209A
Publication Date:
April 28, 2005
Filing Date:
October 09, 2003
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
B32B15/08; G11B5/60; (IPC1-7): B32B15/08; G11B5/60
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