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Patent Searching and Data


Title:
HEAT INSULATING BOARD, MANUFACTURE THEREOF, AND EARTHQUAKE RESISTANT WALL STRUCTURE USING IT
Document Type and Number:
Japanese Patent JPH08302860
Kind Code:
A
Abstract:

PURPOSE: To obtain excellent heat insulation property and sound insulation property by fitting a heat insulating board formed by integrally clamping a low density foam urethane plate by two pressure molded paper plates between two columns erected at a designated space between them and fixing the same by metallic plates.

CONSTITUTION: A heat insulating board 6 clamped integrally with a low density foam urethane plate between two pressure molded paper plates, at least the outer surface of which are subjected to waterproof processing, is fitted between two columns 1, 2 of a building. Two columns 1.2 and the heat insulating board 6 are fixed by metallic plates 7, and further as the longitudinal central part of the low density urethane plate is clamped and fixed by a rafter and a furring fatten, the strength can be further increased. Accordingly, even if the external force is applied to the thus constructed wall from the directions of arrows 10-13 by an earthquake or the like, the connection between a set of columns 1, 2 and the heat insulating board 6 is strong so as to obtain a satisfactory earthquake resistant structure without a diagonal brace.


Inventors:
TANAKA YUTAKA
Application Number:
JP11200895A
Publication Date:
November 19, 1996
Filing Date:
May 10, 1995
Export Citation:
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Assignee:
TANAKA KK
International Classes:
E04B2/56; E04B1/76; E04B1/80; (IPC1-7): E04B2/56; E04B1/76; E04B1/80; E04B2/56
Attorney, Agent or Firm:
Suzuki Seiji