Title:
HEAT INSULATING DOOR BODY
Document Type and Number:
Japanese Patent JP3785564
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulating door body capable of preventing cracks from occurring in an inner plate around holes punches where a back panel contacts the inner plate without applying paper tape having nonadhesive surfaces and the like.
SOLUTION: The heat insulating door body is formed by injecting and foaming a heat insulating foaming material 16 into a space defined by a door panel 1, an inner plate 2 disposed to face the door panel 1, a back panel 3 attached to the inner panel 2 at the side of the door panel 1 in such a way as to partially contact each other and having holes (8a) and (9a) punched at the contacting portions for fitting, fixing and the like, door caps 5 for fitting onto the upper and lower ends of the door and the like. Shallow concave portions 10 and 11 are provided around the holes (a) of the back panel 3 to form thin heat insulating material foaming core layers 13 in gaps between the holes (a) and the inner plate surfaces facing the same.
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Inventors:
Kazuhiro Kato
Application Number:
JP2000328629A
Publication Date:
June 14, 2006
Filing Date:
October 27, 2000
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
F25D23/08; F25D23/02; (IPC1-7): F25D23/08; F25D23/02
Domestic Patent References:
| JP2000199678A | ||||
| JP10132455A | ||||
| JP56094490U | ||||
| JP10019454A | ||||
| JP46012775Y2 | ||||
| JP61145295U | ||||
| JP10205997A | ||||
| JP61130887U |
Attorney, Agent or Firm:
Souji Sasaki
Hisao Kobayashi
Saburo Kimura
Noboru Omura
Hisao Kobayashi
Saburo Kimura
Noboru Omura
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