Title:
HEAT INSULATING MATERIAL
Document Type and Number:
Japanese Patent JP2002283485
Kind Code:
A
Abstract:
To provide a heat insulating material which is used in a clean room relating to a semiconductor, or the like, and which has no dust producing property, in particular, and hardly burns or smokes in an emergency.
The heat insulating material 100 is constituted of a fire-retardant and/or non-combustible porous heat insulating material 110 and a cloth body 120 covering the heat insulating material 110 and having electroconductive fibers and/or antistatic fibers woven thereinto.
Inventors:
MIYAHARA YOSHIHISA
TAKAGI HIROSHI
WAKABAYASHI ATSUSHI
TAKAGI HIROSHI
WAKABAYASHI ATSUSHI
Application Number:
JP2001086836A
Publication Date:
October 03, 2002
Filing Date:
March 26, 2001
Export Citation:
Assignee:
NICHIAS CORP
International Classes:
E04B1/80; B32B5/24; B32B27/42; E04C2/24; F16L59/02; (IPC1-7): B32B5/24; B32B27/42; E04B1/80; E04C2/24; F16L59/02
Attorney, Agent or Firm:
Kyoukan Iwata (1 person outside)
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