Title:
HEAT AND PRESS BONDER FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3731654
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To control the thickness of an adhesive layer after bonding with accuracy, by suppressing overshoot and dispersion of the pressure, in a heat and press bonder which bonds and fixes with each other a plurality of works being set with adhesive layers between by heating and pressing them.
SOLUTION: The heat and pressure bonder is equipped with a stage 3 for setting a work WK, heating and pressing head parts 24, 25, 27, 30, and 45-50 for heating and pressing the work WK, pressing parts 15-18, 20, 26, 28, and 29, including a pressing cylinder 29 for elastically pressing the heating and pressing head part to the work WK, and a feeder part 5-13 for shifting the heating and pressing head part and the pressing part to the work WK and also positioning them. Moreover, this bonder is equipped with a floating cylinder 21 for offsetting the mass of the heating and pressing head part.
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Inventors:
Akira Kida
Application Number:
JP2002049196A
Publication Date:
January 05, 2006
Filing Date:
February 26, 2002
Export Citation:
Assignee:
Kida Precision Machinery Co., Ltd.
International Classes:
B23K1/00; H01L21/60; B23K3/00; H05K3/32; (IPC1-7): H01L21/60; H05K3/32; //B23K1/00; B23K3/00
Domestic Patent References:
| JP11297749A | ||||
| JP2002033338A | ||||
| JP2001203497A | ||||
| JP11121474A |
Attorney, Agent or Firm:
Naomi Matsumoto
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