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Title:
HEAT-PUMP HOT-WATER SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2009085524
Kind Code:
A
Abstract:

To provide a heat-pump hot-water supply device in which a flow of hot water supplied to an open hot-water storage tank is finely controlled.

This heat-pump hot-water supply device 100 comprises: an open water receiving tank 10 for storing water used for hot-water supply; a heat pump unit 20 for boiling the water stored in the water receiving tank 10 to hot water; the open hot-water storage tank 30 for storing the hot-water boiled by the heat pump unit 20 ready for hot-water delivery; a hot-water supply pump 41 for leading the water stored in the water receiving tank 10 to the heat pump unit 20 or boosting the pressure of the hot water boiled by the heat pump unit 20, and feeding out it the hot-water storage tank 30; a flow control valve 42 capable of regulating the flow of the hot water fed from the heat pump unit 20 to the hot-water supply pump 41 by the hot-water supply pump 41; and a control device 40 for controlling an opening of the hot-water supply pump 41 and an open time of the flow control valve 42.


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Inventors:
YOSHIDA AKIRA
OTA MITSUAKI
OBAYASHI MASAYOSHI
ABE TOSHIRO
SUGIMOTO TAKESHI
Application Number:
JP2007257072A
Publication Date:
April 23, 2009
Filing Date:
October 01, 2007
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
F24H1/00; F24H1/18
Domestic Patent References:
JP2006284141A2006-10-19
JPS59208192A1984-11-26
JP2005055124A2005-03-03
JP2007040566A2007-02-15
JP2006329558A2006-12-07
Attorney, Agent or Firm:
Hisao Kobayashi
Kiyoshi Yasushima
Souji Sasaki
Noboru Omura
Takanashi Norio