Title:
HEAT PUMP WITH ADSORPTION TYPE COOLING DEVICE
Document Type and Number:
Japanese Patent JP2005147550
Kind Code:
A
Abstract:
To provide a heat pump allowing further improvement of a COP (coefficient of performance).
In this heat pump, a main body has a booster 10 boosting a refrigerant, a condenser 11 condensing the refrigerant boosted by the booster by heat exchange with a heated fluid such as outside air, and an evaporator evaporating the refrigerant condensed in the condenser by heat exchange with a cooled fluid such as indoor air. An adsorption type cooling device A further cooling the refrigerant condensed in the condenser 11 by an adsorbate with heat of the refrigerant boosted by the booster 10 as a regenerative heat source of the adsorbing material is attached.
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Inventors:
KAKIUCHI HIROYUKI
YAMAMOTO HIDESATO
TAKEWAKI TAKAHIKO
YAMAZAKI MASANORI
WATANABE NOBU
WATANABE KENJI
YAMAMOTO HIDESATO
TAKEWAKI TAKAHIKO
YAMAZAKI MASANORI
WATANABE NOBU
WATANABE KENJI
Application Number:
JP2003386679A
Publication Date:
June 09, 2005
Filing Date:
November 17, 2003
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
TOKYO ELECTRIC POWER CO
TOKYO ELECTRIC POWER CO
International Classes:
F25B25/02; F25B30/02; (IPC1-7): F25B25/02; F25B30/02
Attorney, Agent or Firm:
Kazuhiko Okada
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