HEAT RADIATING FIN

Japanese Patent JP3139523

B2

PURPOSE: To prevent the bends of metallic layers, etc., and prevent the deformation of a heat radiating fin, by providing a ceramic board on a first metallic layer on the rear surface of a ceramic circuit board, and by bonding to the ceramic board in a laminar way in succession a second metallic layer and the main body of the heat radiating fin via respective aluminum based brazing materials.
CONSTITUTION: On the rear surface of a ceramic circuit board 13, a first metallic layer 21 made of an aluminum material which has an area enough to cover the board 13 is provided. On the first metallic layer 21, a ceramic board 18 which has an area enough to cover the layer 21 is laminated. Then, on the ceramic board 18, a second metallic layer 22 made of an aluminum material which has an area enough to cover the board 18 is laminated. Further, on the second metallic layer 22, a main body 19 of a heat radiating fin which has an area enough to cover the layer 22 is formed in a laminar way. In these cases, the laminar layers present between the first mtallic layer 21 and the main body 19 of the heat radiating fin are bonded to each other via aluminum based brazing materials. Thereby, the bends of the respective laminar layers can be prevented by the absorptions of their thermal deformations, and as a result, the deformation of the main body 19 of the heat radiating fin can be prevented.

Toshiyuki Nagase
Yoshio Kanda
Masafumi Hatsushika

JP16372594A

March 05, 2001

July 15, 1994

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Mitsubishi Materials Corporation

H01L23/36; H01L23/40; (IPC1-7): H01L23/36; H01L23/40

JP4363052A
JP57138198A
JP62287649A
JP541471A
JP6188329A

Masayoshi Suda

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