Title:
HEAT RADIATION SUBSTRATE AND MANUFACTURING METHOD OF HEAT RADIATION SUBSTRATE
Document Type and Number:
Japanese Patent JP2017075397
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat radiation substrate that is a metal layer produced with an alloy composite body containing a metal and a diamond powder as a main ingredient, and having a linear expansion coefficient of 6.5 ppm/K or larger and 15 ppm/K or smaller and heat conductivity of 420 W/m K or larger and repaired surface defect and on which nickel-base plating of which void fraction of soldering is 5% or smaller can be applied.SOLUTION: A metal layer is formed on a surface of an alloy composite of which main component is a main metal, an additive metal and a powder of diamond by plating, the metal layer and the alloy composite are heated and pressurized at a melting temperature or lower, and thereby a heat radiation substrate having a metal layer having slight surface defects is obtained.SELECTED DRAWING: Figure 1
Inventors:
FUKUI AKIRA
Application Number:
JP2016195384A
Publication Date:
April 20, 2017
Filing Date:
October 03, 2016
Export Citation:
Assignee:
HANDOTAI NETSU KENKYUSHO:KK
International Classes:
C25D5/12; B22F1/00; C22C26/00; C23C18/52; C25D5/48; C25D7/00; H01L23/36; H01L23/373
Attorney, Agent or Firm:
Kyoto International Patent Office