Title:
HEAT-RESISTANT ADHESIVE COMPOSITION FOR CSP SUBSTRATE, HEAT-RESISTANT ADHESIVE SHEET USING THE SAME, AND PRODUCTION OF CSP SUBSTRATE
Document Type and Number:
Japanese Patent JP3688133
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a heat resistant adhesive composition for CSP substrates, excellent in adhesiveness between a polyimide substrate and copper foil and excellent in heat resistance and PCT resistance, and a heat resistant adhesive sheet using the above adhesive composition, and provide a method for producing a CSP substrate by using the heat-resistant adhesive sheet.
SOLUTION: This heat-resistant adhesive composition for CSP substrates comprises 100 pts.wt. siloxane-modified polyamideimide resin and 1-150 pts.wt. thermosetting resin. The heat-resistant adhesive sheet 9 is an adhesive sheet obtained by forming an adhesive onto a polyimide substrate 5 and forming the above CSP substrate in B stage onto at least one side of the polyimide substrate. The method for producing CSP substrates comprises (1) a step for forming through holes becoming solder ball holes onto the above heat resistant adhesive sheet, (2) a step for laminating copper foil onto B stage face 4 on one side of the heat-resistant adhesive sheet, (3) a step for forming a circuit 7 by removing unnecessary parts of copper foil by etching and (4) a step for plating the circuit surface with gold.
Inventors:
Kazumasa Takeuchi
Tetsuya Saito
Ken Nanami
Tetsuya Saito
Ken Nanami
Application Number:
JP27114998A
Publication Date:
August 24, 2005
Filing Date:
September 25, 1998
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L23/14; C08L79/08; C08L101/00; C09J179/08; C09J201/00; (IPC1-7): C09J179/08; C08L79/08; C08L101/00; C09J201/00; H01L23/14
Domestic Patent References:
| JP10130500A | ||||
| JP8034968A | ||||
| JP11217503A |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Fumio Shinoda