Title:
HEAT RESISTANT FRICTION PLATE MATERIAL AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2009114379
Kind Code:
A
Abstract:
To provide a heat resistant friction plate material having stable friction coefficient at ordinary or even high temperature and high durability and keeping reliability through a long period.
In the heat resistant friction plate obtained by impregnating a sheet-like base material with a polyamideimide resin composition and heating and curing, the polyamideimide resin composition contains (A) a polyamideimide resin, (B) an epoxy resin and (C) an inorganic filler as inevitable components wherein the 5% mass-reducing temperature of a cured product is 400C.
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Inventors:
KINAMI YU
UCHIDA NOBUHIKO
UCHIDA NOBUHIKO
Application Number:
JP2007290829A
Publication Date:
May 28, 2009
Filing Date:
November 08, 2007
Export Citation:
Assignee:
KYOCERA CHEM CORP
International Classes:
C09K3/14; C08J5/14; C08K3/00; C08L63/00; C08L79/08
Attorney, Agent or Firm:
Saichi Suyama
Yukio Kawahara
Satoshi Yamashita
Hideaki Suyama
Yukio Kawahara
Satoshi Yamashita
Hideaki Suyama