Title:
耐熱離型シートとその製造方法
Document Type and Number:
Japanese Patent JP6470461
Kind Code:
B2
Abstract:
A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.
Inventors:
Akiha Prefectural Government
Yuta Kuroki
Yuta Kuroki
Application Number:
JP2018155522A
Publication Date:
February 13, 2019
Filing Date:
August 22, 2018
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
B32B27/00; B32B27/30; B32B27/34
Domestic Patent References:
| JP61141532A | ||||
| JP8276547A | ||||
| JP7011028A | ||||
| JP62162542A | ||||
| JP62223236A | ||||
| JP2008127471A |
Foreign References:
| WO2015052860A1 |
Attorney, Agent or Firm:
Koichi Kamata