PURPOSE: To obtain a heat resistant resin composition containing each specific polyimide, a novolak and a resol, capable of exhibiting good physical properties, moldability, and heat resistances and useful for a molding material, etc.

CONSTITUTION: This heat resistant resin composition comprises containing (A) a polyimide having phenolic hydroxy groups in a molecule (e.g. compound of the formula) obtained by reacting three components of (i) a sulfanilamide, (ii) a bismaleimide (e.g. N, N'-diphenylmethanebismaleimide), (iii) aminophenols having an amino group and a phenolic hydroxy group simultaneously (e.g. paraaminophenol), (B) a novolak and (C) a resol obtained by reacting phenols with aldehydes under an alkali catalyst. Moreover, the composition preferably contains 30-70 pts.wt. component (A) and 70-20 pts.wt. mixture of (B) and (C) [10-70wt.% component (B) and 30-90wt.% component (C)].