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Patent Searching and Data


Title:
HEAT RESISTANT RESIN MOLDING OF EXCELLENT WEAR RESISTANCE
Document Type and Number:
Japanese Patent JPS6445636
Kind Code:
A
Abstract:

PURPOSE: To improve heat resistance, wear resistance, weatherability, durability and adhesive properties by providing, on the surface of a heat resistance resin molding, a cured film of a crosslinkingly curable resin material comprising a monomer mixture composed of a specific multifunctional monomer mixture and a specific monofunctional monomer, and an ultraviolet absorber.

CONSTITUTION: A monomer mixture (A) is composed of a monomer (a) represented by general formula (I) to impart wear resistance to a cured film, a multifunctional monomer (b) represented by general formula (II) to prevent appearance change of an obtained molding such as weatherability and insufficient adhesion from occurring, and a bifunctional monomer (c) which improves weatherability of the cured film and has one (meth)acryloxy group in one molecule, and having straight or branched saturated hydrocarbon group having at most 20 carbon atoms for bonding the (meth)acryloxy group. For providing a cured film of a crosslinkingly curable resin material. 0W30pts.wt. ultraviolet absorber (B) is blended per 100pts.wt. monomer mixture (A), which has a composition ratio of (a)/(b)/(c)=80W30/70W20/50W5wt.%.


Inventors:
TAYAMA SUEHIRO
NISHIDA KOJI
TAMURA MISAO
MORIMOTO MASARU
Application Number:
JP20321887A
Publication Date:
February 20, 1989
Filing Date:
August 17, 1987
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
B32B27/30; C08J5/00; (IPC1-7): B32B27/30; C08J5/00
Attorney, Agent or Firm:
Yamashita