Title:
熱感知
Document Type and Number:
Japanese Patent JP5000204
Kind Code:
B2
Abstract:
In thermal sensing devices, such as for calorimetry, a support layer or central layer can have a thermometer element or other thermal sensor on one side and a thermally conductive structure or component on the other. The thermally conductive structure can conduct temperature or other thermal input signals laterally across the support layer or central layer. The temperature or signals can then be provided to the thermometer element, such as by thermal contact through the support layer. An electrically conducting, thermally isolating anti-coupling layer, such as of gold or chromium, can reduce capacitive coupling between the thermally conductive structure and the thermometer element or other thermal sensor.
More Like This:
| JP6931150 | Temperature measuring device |
Inventors:
Richard H. Bruce
Dirk de Bruyer
Francisco E Torres
Mikal Vie Walkin
Dirk de Bruyer
Francisco E Torres
Mikal Vie Walkin
Application Number:
JP2006169714A
Publication Date:
August 15, 2012
Filing Date:
June 20, 2006
Export Citation:
Assignee:
Palo Alto Research Center, Inc.
International Classes:
G01K3/06; G01F1/68; G01K1/00; G01K7/24; G01K7/30; G01K17/00; G01N25/20; G01N25/48; G01N27/00
Domestic Patent References:
| JP7260589A | ||||
| JP2003308955A | ||||
| JP5028992U | ||||
| JP2003315292A |
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda