To provide a heat-sensitive, pressure-sensitive adhesive which can improve adhesion to an area, which is difficult to bond, without lowering the blocking resistance by specifying the amt. of vinyl chloride constituting an ethylene/vinyl acetate/vinyl chloride copolymer (EA) used in a heat-sensitive, pressure-sensitive adhesive.
The amt. of vinyl chloride constituting EA used as a thermoplastic resin is 20 to 60wt.%. Many of EAs have relatively high glass transition temp. and hence is used in combination with other thermoplastic resin having a relatively low glass transition temp. (e.g. ethylene/vinyl acetate copolymer) in order to impart a film-forming property. The glass transition temp. is pref. -5°C or above from the viewpoint of the blocking resistance and is pref. 30°C or below from the viewpoint of the film-forming property. Any conventional tackifier may be used, and, e.g. a tackifier having a softening temp. of 80°C or above, e.g. a terpene resin, may be used. A solid plasticizer, e.g. dicyclohexyl phthalate, may be used, and the regulation of the max. particle diameter thereof to not more than 50μm is pref.
SHIRAISHI KINYA
IIDA HIROYUKI
KAMEYAMA MAKOTO
