Title:
略一定の温度を維持するための熱シールド
Document Type and Number:
Japanese Patent JP7077369
Kind Code:
B2
Abstract:
When products to be shipped are temperature-sensitive, it is necessary to maintain a substantially uniform and constant temperature to avoid spoilage. As a result, thermal shields are often placed on top of the products. Many designs for thermal shields have been considered in the past but improvements are still desired. Accordingly, there is provided a multilayer thermal shield (100) comprising a thermally conductive layer (108), and at least one heat exchange fluid circuit (120) coupled to a first surface of the thermally conductive layer, the at least one heat exchange fluid circuit comprising at least one inlet (124) configured to permit the ingress of heat exchange fluid. The thermal shield further comprises an outer insulation layer (104) connected to a first surface of the thermally conductive layer (108) and comprising grooves designed to receive the heat exchange fluid circuit. The thermal shield further comprises an inner insulation layer (110) connected to a second surface of the thermally conductive layer (108).
More Like This:
Inventors:
Vladimir Goldstein
Corey Rosa
Con-bin do
Corey Rosa
Con-bin do
Application Number:
JP2020121976A
Publication Date:
May 30, 2022
Filing Date:
July 16, 2020
Export Citation:
Assignee:
Sunwell Engineering Company Limited
International Classes:
F16L59/02; B32B7/027; B65D88/74; B65D90/02; F25D9/00; F25D11/00; F25D16/00; F25D23/06
Domestic Patent References:
| JP2000511275A | ||||
| JP8049867A | ||||
| JP5934221U | ||||
| JP201517801A |
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe