Title:
HEAT SHRINKABLE FILM AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3966782
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a shrink film which retains heat shrinkability as an indispensable property of a shrink packaging material and high lubricity.
SOLUTION: The shrink film is composed of a polyamide resin (a) and a polyamide elastomer resin(b) and contains 80 to 97 mass% of the polyamide resin (a) and 3 to 20 mass% of the polyamide elastomer resin (b). The coefficient of dynamic friction of the shrink film is not more than 0.8 and the shrinkage factor when the film is processed in hot water at 80°C is 15 to 40%.
Inventors:
Takehiro Nakamura
Fumihiko Hosokawa
Kenichi Yamagishi
Fumihiko Hosokawa
Kenichi Yamagishi
Application Number:
JP2002209654A
Publication Date:
August 29, 2007
Filing Date:
July 18, 2002
Export Citation:
Assignee:
UNITIKA LTD.
International Classes:
B29C61/06; C08J5/18; B29C55/02; C08L77/00; B29K77/00; B29K105/02; B29L7/00; (IPC1-7): B29C61/06; B29C55/02; C08J5/18; C08L77/00; //B29K77:00; B29K105:02; B29L7:00
Domestic Patent References:
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| JP2003012921A | ||||
| JP2001064415A | ||||
| JP5230365A | ||||
| JP8165427A | ||||
| JP8267674A | ||||
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