HEAT SINK FOR SEMICONDUCTOR ELEMENT

Title:

HEAT SINK FOR SEMICONDUCTOR ELEMENT

Document Type and Number:

Japanese Patent JPS5272177

Kind Code:

A

Inventors:

IKEDA YOSHIHIKO
ISHIHARA KAZUO
YUGAWA HIDEKI

Application Number:

JP14827575A

Publication Date:

June 16, 1977

Filing Date:

December 12, 1975

Export Citation:

Assignee:

KOKUSAN DENKI CO

International Classes:

H01L23/32; H01L23/00; H01L23/34; H01L23/40; (IPC1-7): H01L23/00; H01L23/34

Domestic Patent References:

Previous Patent: METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING MULTILAYER RESIST MASK

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