ヒートシンク板 - AM Technology Co., Ltd.

Title:

ヒートシンク板

Document Type and Number:

Japanese Patent JP4223730

Kind Code:

B2

Abstract:

To provide a heat sink material whose thermal conductivity is 300-400 W/mK or larger and whose coefficient of thermal expansion is between 12 to 4 ppm/K.

By integrating two kinds of complex materials, a heat sink plate having high thermal conductivity of superior workability and an appropriate coefficient of thermal expansion is provided.

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Inventors:

Suzuki Nobuyuki
Terashi Akira
Kiyoshi Sato

Application Number:

JP2002111814A

Publication Date:

February 12, 2009

Filing Date:

April 15, 2002

Export Citation:

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Assignee:

AM Technology Co., Ltd.
Tokyu Co., Ltd.

International Classes:

C22C47/06; H01L23/36; C22C47/12; C22C49/06; H01L23/373; H05K7/20; C22C101/10; C22C101/14; C22C101/16; C22C101/22

Domestic Patent References:

JP1012780A
JP10107190A
JP11322473A
JP2000281468A
JP609838A
JP2002103213A
JP200158255A

Attorney, Agent or Firm:

Tetsuo Hotaka

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