Title:
HEAT-TREATING DEVICE
Document Type and Number:
Japanese Patent JP3664193
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance the quality and throughput of an object to be treated by a method wherein the heat capacity or heat absorption characteristics of a support part for supporting the material to be treated is/are changed in the insertion direction of the material to be treated for reducing a temperature difference within the surface of the material to be treated due to the insertion time differential of the material to be treated.
SOLUTION: In a transfer arm 19, a base part arm part 19a with one end provided horizontally on the upper part of a base 18 is rotatably provided, an intermediate arm part 19b with one end provided horizontally under the other end of this arm part 19a is rotatably provided and moreover, a point arm part 19c with one end provided horizontally on the other end of this arm part 19b is rotatably provided. This arm part 19 is provided with a wafer support part 20 and the heat capacity or heat absorption characteristics of this support 20 is/are changed in the insertion direction of an object W to be treated for reducing a temperature difference within the surface of the object W to be treated due to the insertion time differential of the object W to be treated. Thereby, the quality and throughput of the object W to be treated can be enhanced.
Inventors:
Soichi Sugano
Application Number:
JP4795296A
Publication Date:
June 22, 2005
Filing Date:
February 09, 1996
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/677; H01L21/205; H01L21/22; H01L21/31; H01L21/324; H01L21/68; (IPC1-7): H01L21/68; H01L21/205; H01L21/22; H01L21/31; H01L21/324
Domestic Patent References:
| JP5304196A | ||||
| JP5152224A | ||||
| JP4372385A |
Attorney, Agent or Firm:
Noriyuki Kanasaka
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