HEAT TREATMENT DEVICE AND METHOD THEREFOR USING THE SAME AND FILM FORMING METHOD

Title:

HEAT TREATMENT DEVICE AND METHOD THEREFOR USING THE SAME AND FILM FORMING METHOD

Document Type and Number:

Japanese Patent JP2002124483

Kind Code:

A

Abstract:

To solve a problem that a wavelength converting board is damaged by heat distortion due to the efficient heating of a glass substrate by the emission of the wavelength of an area which the glass substrate can absorb as secondary radiation, by permitting the wavelength converting board to absorb the light of wavelength which is irradiated from an infrared lamp, and to raise a temperature by installing the wavelength converting board between the infrared lamp and the glass substrate in a conventional high speed heat treatment device using the infrared lamp as a device which speedily performs heat treatment on the substrate at a high temperature.

The wavelength converting board is constituted of at least two or more pieces. Thus, a damage by the heat distortion to the wavelength converting board is prevented.

Inventors:

IDO MASUMI
YAMAMOTO MUTSUMI

Application Number:

JP2000317442A

Publication Date:

April 26, 2002

Filing Date:

October 18, 2000

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

F27B17/00; F27D7/06; F27D11/02; H01L21/20; H01L21/26; H01L21/268; H01L21/316; H01L21/336; H01L29/786; (IPC1-7): H01L21/26; F27B17/00; F27D7/06; F27D11/02; H01L21/20; H01L21/268; H01L21/316; H01L21/336; H01L29/786

Attorney, Agent or Firm:

Fumio Iwahashi (2 others)

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