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Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP3474258
Kind Code:
B2
Abstract:

PURPOSE: To provide a heat treatment device which is enhanced in throughput and lessened in thermal history by a method wherein a reaction tube is enhanced in temperature-rise rate.
CONSTITUTION: A heat releasing body 5 composed of a resistance heating wire 51 and a supporter 52 which supports it is provided surrounding a reaction tube 2, five cylindrical heat radiating plates 6 are disposed around the heat releasing body 5 through the intermediary of an empty space. When the reaction tube 2 is made to rise in temperature by the treat releasing body 5 as a space between the heat releasing body 5 and the heat, radiating plates 6 and another space between the heat radiating plates 6 are reduced in pressure, heat is communicated through these spaces by radiation. Therefore, heat released from the heat releasing body 5 radiates towards the reaction tube 2 and also the heat radiating plate 6 concurrently, and heat released from the heat radiating plate 6 heated by radiant heat radiates towards the outer heat radiating plate 6 and also the reaction tube 2 concurrently. Therefore, heat transmitted outwards from the heat releasing body 5 is partially returned to the heat releasing body 5, so that the reaction tube 2 is quickly raised in temperature.


Inventors:
Tamotsu Morimoto
Application Number:
JP9934894A
Publication Date:
December 08, 2003
Filing Date:
April 12, 1994
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/22; C23C16/48; C30B25/10; C30B31/12; H01L21/00; H01L21/205; H01L21/31; H01L21/324; (IPC1-7): H01L21/22; H01L21/205; H01L21/31; H01L21/324
Domestic Patent References:
JP1300517A
JP5989991A
Attorney, Agent or Firm:
Toshio Inoue