Title:
HEATER AND HEATING PROCESSING DEVICE USING SUCH HEATER
Document Type and Number:
Japanese Patent JP3426612
Kind Code:
B2
Abstract:
PURPOSE: To lessen the dispersion in temperature distribution in radial direction and circumferential direction of a wafer stage by interposing at least one conductor line for heating between a certain connection and a connection adjacent in radial direction to the connection.
CONSTITUTION: A heater consists of eight conductor lines for heating arranged coaxially. The innermost conductor 21 for heating has two cut ends 21A and 21B, being cut at one place. The outermost conductor line 28 for heating has two cut ends 28A and 28B and two external connection ends 28C and 28D, being cut at two places. The two cut ends 26A and 26B, opposite in phase, of the sixth conductor lines 26 for heating counted from the innermost periphery are connected to the two cut ends 25A and 25B opposed in roughly radial direction of the fifth conductor line 25, respectively. And, the temperature distribution inside the wafer stage can be made uniform by using this heater.
Inventors:
Koji Tamamura
Sadao Tanaka
Megumi Takatsu
Sadao Tanaka
Megumi Takatsu
Application Number:
JP2744192A
Publication Date:
July 14, 2003
Filing Date:
January 20, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
C23C16/46; C30B25/12; H01L21/205; H01L21/31; H01L21/324; (IPC1-7): H01L21/205; H01L21/31
Domestic Patent References:
| JP479182A |
Attorney, Agent or Firm:
Takahisa Yamamoto