Title:
半導体製造装置用ヒータモジュール
Document Type and Number:
Japanese Patent JP4311914
Kind Code:
B2
Abstract:
Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater part 1a for controlled heating of a wafer placed on its top face, and block part 3a provided to be shiftable relative to said heater part, for varying heat capacity in total with heater part 1a by abutting on or separating from the reverse surface of heater part 1a. By having the heat capacity of block part 1b be 20% or more of the total heat capacity of heater part 1a and block part 1b, the heater cooling speed can be made 10 DEG C/min or more.
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Inventors:
Shuhei Uesugi
Hirohiko Nakata
Hirohiko Nakata
Application Number:
JP2002163747A
Publication Date:
August 12, 2009
Filing Date:
June 05, 2002
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
C23C16/46; H01L21/205; H01L21/00; H01L21/302; H01L21/3065
Domestic Patent References:
| JP2000164601A | ||||
| JP737768A | ||||
| JP2000100734A | ||||
| JP2001313155A | ||||
| JP2001313260A | ||||
| JP20029053A |
Attorney, Agent or Firm:
Masao Yamamoto