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Title:
HEATING CONDITION SETTER FOR HEATING FURNACE AND THERMAL ANALYZER FOR ARTICLE TO BE HEATED IN HEATING FURNACE
Document Type and Number:
Japanese Patent JP3274095
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To minimize thermal damage onto small electronic parts mounted on a printed wiring board by grasping the relation between variation in the heating conditions of each heat source and temperature variation at each detecting point of an article to be heated and then setting heating conditions for bringing each detecting pint to a target temperature uniquely.
SOLUTION: Inside of the tunnel-like body 1 of a reflow furnace is divided into four zones, for example, and each zone is provided with a heating source comprising far infrared heaters 4, 7, a near infrared heater 5 and a hot air fan heater 6. At the time of reflow soldering of a printed wiring board 2, it is heated during a process for carrying the board 2 on a conveyor 3 from an inlet A toward an outlet B. In order to prevent thermal damage due to abrupt heating, the board 2 is preheated and then heated uniformly. More specifically, variation in the heating conditions of each heating source and temperature variation at each detecting point of the board 2 are calculated thus setting heating conditions for bringing each detecting pint to a target temperature.


Inventors:
Uchida, Hiromoto
Sakuyama, Seiki
Application Number:
JP1998000119423
Publication Date:
April 15, 2002
Filing Date:
April 28, 1998
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B23K1/00; B23K1/008; B23K3/04; B23K31/02; F27B9/06; F27B9/36; F27B9/40; G05D23/19; H05K3/34; (IPC1-7): F27B9/06; B23K1/00; B23K1/008; B23K3/04; B23K31/02; F27B9/36; F27B9/40; H05K3/34
Attorney, Agent or Firm:
野河 信太郎