Title:
HEATING DEVICE FOR THERMOTOLOGICAL DEVICE
Document Type and Number:
Japanese Patent JP2001198149
Kind Code:
A
Abstract:
To provide a heating device for a thermotological device capable of minimizing generation of A/S, preventing deformation of a case or breakage of a lead wire by heat so as to provide a high quality product for consumers.
A heating element 300 provided inside a heating cap 200 comprises PTC semiconductor, and it is electrically actuated to be heated to a constant temperature. Generated heat is transmitted through a heating plate 500 upward only to heat the heating cap 200. Since the heating plate 500 is layered at an upper stage, so the heat is transmitted upward only, thereby breakage of a lead wire can be prevented.
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Inventors:
LEE SANG BOK
Application Number:
JP2000364550A
Publication Date:
July 24, 2001
Filing Date:
November 30, 2000
Export Citation:
Assignee:
MIGUN MEDICAL INSTR CO LTD
International Classes:
A61F7/08; A61F7/00; A61F7/02; A61H23/02; (IPC1-7): A61F7/08
Attorney, Agent or Firm:
Kamei Miaki (3 others)