Title:
HEAT SINK FIXING STRUCTURE
Document Type and Number:
Japanese Patent JP2023121391
Kind Code:
A
Abstract:
To reduce the load on the soldering section of electronic components.SOLUTION: A heat sink fixing structure includes a heat sink 4 fixed to the body part 3A of the electronic component 3 whose leg 3B is connected to the substrate 2 by soldering, a flexible mounting part 1C provided in the equipment body 1 to which the substrate 2 is fixed, and a joining member 10 joining the heat sink 4 and the mounting part 1C.SELECTED DRAWING: Figure 3
Inventors:
SUGIYAMA DAISUKE
Application Number:
JP2022024713A
Publication Date:
August 31, 2023
Filing Date:
February 21, 2022
Export Citation:
Assignee:
JVC KENWOOD CORP
International Classes:
H05K7/20
Attorney, Agent or Firm:
Sakai International Patent Office