To provide a hermetically sealed structure capable of sealing a package and a lid with no risk of environmental pollution, adjusting a frequency with precision and preventing a rise in a CI value, a piezoelectric device and its manufacturing method.
In the hermetically sealed structure composed of a base board 31 to be a portion of a housing body for integrally forming or joining an electronic component and a lid 33 being a cover body hermetically joined to the base body, wherein the lid is made of material that transmits light, and a platable layer 22 for plating and a joining layer 24 made of gold and formed closer to a front side than the platable layer are formed as a metal layer 25 of at least a sealing part of the lid and joined to the base body 31 by solder 49 of an Au-Ge alloy.
| JP2004135090 | SURFACE MOUNTED PIEZOELECTRIC RESONATOR |
| JPS59178010 | PIEZOELECTRIC VIBRATOR |
| JPS5753124A | 1982-03-30 | |||
| JP2001267875A | 2001-09-28 | |||
| JPH09148878A | 1997-06-06 | |||
| JP2004194290A | 2004-07-08 | |||
| JP2005348082A | 2005-12-15 | |||
| JP2005295322A | 2005-10-20 |
| WO2003017364A1 | 2003-02-27 |
Osamu Suzawa
Kazuhiko Miyasaka