To provide a method for forming a thin film using a high boiling point composition with which uniform film thickness can be obtained in film formation.
A composition includes two or more organic compounds having a boiling point of 100°C or above and one or more polymers having light emission properties in a solid state or charge transport properties, and at least one of the organic compounds is an organic compound selected from an aliphatic compound which may have a hetero atom or an alicyclic compound which may have a hetero atom, the aliphatic compound and the alicyclic compound having a boiling point of 200°C or above. In a method for forming a thin film, the thin film is formed from the composition by means of a method selected from the group consisting of: a spin coating method; a casting method; a micro photogravure coating method; a photogravure coating method; a bar coating method; a roll coating method; a wire bar coating method; a dip coating method; a spray coating method; a screen printing method; a flexographic printing method; an offset-printing method; and an ink jet method.
IIMURA KIYOTOSHI
| JP2004186111A | 2004-07-02 |
| WO2000059267A1 | 2000-10-05 |
Hajime Asamura
Yukihiro Ikeda
Naganuma Akio
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