To overcome the problem of a prior art such that a small area high capacitance structure is required for an integrated circuit employing a copper interconnection.

The capacitor comprises a first conductive layer having an upper surface, a second conductive layer having a bottom surface, and a dielectric layer abutting on the upper surface of a first metal layer and the bottom face of a second metal layer. The first conductive layer is composed of copper, the second conductive layer is composed of a material selected from a group of aluminum, aluminum oxide, tantalum nitride, titanium nitride, tungsten, tungsten nitride, silicon carbide, and their alloys, and the dielectric layer is composed of silicon nitride.