Title:
HIGH CONTACT ANGLE POLYIMIDE INSULATING FILM, ITS MANUFACTURE, AND INJECTION MOLDING DIE EQUIPPED WITH INSULATING FILM
Document Type and Number:
Japanese Patent JP3640724
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily manufacture an injection molding product of excellent external appearance by a method wherein even though polypropylene and ABS resin are used as injection molding resin materials, a sink and a weldline can be prevented from being generated.
SOLUTION: A high contact angle polyimide insulating film is formed wherein it is formed of a laminated insulating film 5 in which a slant film 3 having concentration gradient of a PMDA polyimide and a fluoropolyimide is made to lie between a first insulating film 1 consisting of a PMDA polyimide and a second insulating film 2 consisting of a fluoropolymide on a cavity surface of a die of a shape corresponding to an external appearance surface shape of an injection molded product. The insulating film 5 has a 90° or over contact angle to water, and thermal conductive coefficient obtained by dividing thermal conductivity by a thickness (cm) of the film is 0.03-0.5cal/sec°C.
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Inventors:
Keiko Iida
Application Number:
JP4519696A
Publication Date:
April 20, 2005
Filing Date:
March 01, 1996
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
B32B27/00; B29C33/38; B29C45/26; B32B27/34; C08G73/10; C08L79/08; C23C14/12; (IPC1-7): B29C33/38; B29C45/26; B32B27/00; B32B27/34; C08G73/10; C08L79/08; C23C14/12
Domestic Patent References:
| JP6246797A | ||||
| JP7117084A | ||||
| JP6015776A | ||||
| JP6226749A | ||||
| JP8025488A | ||||
| JP5132763A |
Foreign References:
| US5004627 |
Attorney, Agent or Firm:
Kinichi Kitamura
Tashiro Sakuo
Etsuo Machida
Tashiro Sakuo
Etsuo Machida
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