Title:
HIGH DENSITY PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3693887
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a high density printed board with a box type connector mounted thereon for realizing an inner layer under the connector in the board as well as a wiring pattern on a surface layer in the board economically.
SOLUTION: In the printed board 8 on which the box type connector 1 is mounted, an insulating part 3 is provided between the box type connector 1 and the board 8. The insulating part 3 prevents contact between a case 9 and a wiring pattern 10 extending from a part 11 to a signal pin 12. Then, the wiring pattern on the board surface layer 7 can be formed.
Inventors:
Izumi Masanori
Application Number:
JP2000153675A
Publication Date:
September 14, 2005
Filing Date:
May 24, 2000
Export Citation:
Assignee:
NEC System Technology Co., Ltd.
International Classes:
H05K3/28; H05K1/02; H05K1/18; (IPC1-7): H05K3/28; H05K1/02; H05K1/18
Domestic Patent References:
| JP5926271U | ||||
| JP287694A | ||||
| JP642467U |
Attorney, Agent or Firm:
Tadashi Takahashi
Masatake Shiga
Masakazu Aoyama
Yasuhiko Murayama
Masatake Shiga
Masakazu Aoyama
Yasuhiko Murayama