Title:
HIGH-DIMENSIONAL SIMILARITY JOIN METHOD BY DIVISION
Document Type and Number:
Japanese Patent JP2004103000
Kind Code:
A
Abstract:
To provide a high-dimensional similarity join method by division capable of efficiently performing similarity join to high-dimensional data without requiring a large amount of storage space in relatively short execution time.
The high-dimensional similarity join method includes a step for dividing a high-dimensional data space and a step for performing join between prescribed data sets, dimensions for dividing the high-dimensional data space and the number of dimensions are predetermined before dividing the high-dimensional data space and each of the cells of the data set are joined only when they are overlapped on the data space or are adjacent to each other.
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Inventors:
SHIN HYO-SEOP
Application Number:
JP2003289264A
Publication Date:
April 02, 2004
Filing Date:
August 07, 2003
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
G06F17/15; G06F7/00; G06F12/00; G06F15/16; G06F17/10; G06F17/30; G06T5/00; (IPC1-7): G06F17/30; G06F12/00; G06F17/15
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe