To improve high frequency characteristics.
A group III nitride-based high electron mobility transistor (HEMT) 20 includes a GaN buffer layer 26, and an AlyGa1-yN(y=1 or ≒1) layer 28 exists on the GaN buffer layer 26. An AlxGa1-xN(0≤x≤0.5) barrier layer 30 exists on the AlyGa1-yN layer 28 on the reverse side of the GaN buffer layer 26, and the Al concentration of the layer 28 is higher than that of the barrier layer 30. A 2DEG 38 is formed on the interface of the GaN buffer layer 26 and the AlyGa1-yN layer 28. On the barrier layer 30, source, drain and gate contacts 32, 34, 36 are formed. On the reverse side of the AlyGa1-yN layer 28, a nucleation layer 24 may be included between the GaN buffer layer 26 and the substrate 22, including a substrate 22 contiguous to the buffer layer 26.
PRASHANT CHAVARKAR
WU YIFENG
IOULIA P SMORCHKOVA
STACIA KELLER
UMESH MISHRA
UNIV CALIFORNIA
JPH11261051A | 1999-09-24 | |||
JP2001085670A | 2001-03-30 | |||
JP2000068498A | 2000-03-03 | |||
JP2000223697A | 2000-08-11 | |||
JP2002076024A | 2002-03-15 |