Title:
HIGH FLUID PHENOLIC RESIN MOLDING AND MOLDING THEREOF
Document Type and Number:
Japanese Patent JP3425986
Kind Code:
B2
Abstract:
PURPOSE: To enable fabrication of high fluid phenolic resin moldings of for low cost high precise optical parts, ultra high precise carbon basement of a magnetic disk, etc., to be finished by a method wherein light transmittance, a number of pores, and a metal content of the phenol resin high fluid molding material are respectively set.
CONSTITUTION: For a high fluid phenolic resin molding, light transmittance per 1mm optical path of visible radiation of 800mm wavelength is set to 80% or over, a number of pores of at least 100μm pore diameter per 1cm is set to under one pore, and a metal content is respectively set to at most 200wt.ppm. Then, in manufacturing, a surface of granular phenol resin wherein its water content is at most 1wt.%, its grain size is at least 50μm, and heat fluidity measured by a disk cure method is 60-160mm, is coated with a low surface tension substance of 30-160°C melting point by 0.2-5wt.% in a composition ratio to phenol resin. Thereafter, the phenol resin molding material is transfer molded, injection molded, or extrusion molded.
Inventors:
Shingo Sasaki
Yamanori Rikunori
Yamanori Rikunori
Application Number:
JP2067593A
Publication Date:
July 14, 2003
Filing Date:
January 12, 1993
Export Citation:
Assignee:
Unitika Ltd.
International Classes:
B29C45/00; B29C47/00; C01B31/00; C08G8/00; C08J7/04; C08L61/06; G02B1/04; G11B5/73; G11B5/82; B29K61/04; (IPC1-7): B29C45/00; B29C47/00; G02B1/04; G11B5/82
Domestic Patent References:
| JP53137294A | ||||
| JP4632503B1 |
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