HIGH-FREQUENCY COIL AND ITS MANUFACTURE

Japanese Patent JP3051660

B2

PROBLEM TO BE SOLVED: To strongly bond a terminal for connecting surfaces and a drum core without releasing the solder plating layer of the fixed part of a terminal for connecting surfaces by enabling the terminals to have a surface connecting part and the fixed part where a winding part is bonded, forming the solder plating layer at an area other than the fixed park and bonding the coil winding part at the fixed part
SOLUTION: A winding part 12 where a coil 11 is wound is a drum core formed by ferrite and a pair of terminals 13 for connecting surfaces are bonded to a bottom surface. A pair of terminals 13 for connecting surfaces have a fixed part 16 and a surface connecting part 16, a ground plating layer 18 is formed on both surfaces of a metal 17, and a solder plating layer 14 is formed on the ground plating layer 18 other than the surface of the fixed part 15. Then, the surface of the fixed part 15 of the terminals 13 for connecting surfaces and the bottom surface of the coil winding part 12 are bonded by an adhesive, thus preventing the solder plating layer 14 from being melted due to heat when dipping the terminals 13 for connecting surfaces in a soldering bath and hence the adhesion strength between the terminals 13 and the winding part 12 from weakening when connecting a lead wire 19 of the coil 11 to the terminals 13 for connecting surfaces.

JPS5256321	STATIC STANDSTILL INDUCTION APPARATUS
JPS62108511	ELECTRIC COIL PART OF THIN STRIPLIKE WINDING STRUCTURE
JP5447353	Transformer for rectifier

Kunio Sasamori

JP19602495A

June 12, 2000

July 07, 1995

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Toko Co., Ltd.

H01F27/28; H01F27/29; H01F41/10; (IPC1-7): H01F27/29; H01F27/28; H01F41/10

JP6290948A

Yu Ohta

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