To eliminate the rud for the adjustment of a resonance frequency and to improve alignment of a dielectric resonator with a high-frequency transmission line by forming a recess on part of a board and embedding the resonator in the recess.
Elements 12, such as active elements (e.g. FETS), a resistance element and a passive element (e.g. a capacitor) are formed on a surface of a GaAs substrate 11. Two or more layers of multilayer interconnections 14, 15 are formed on the board 11 via an insulating layer 13. Then, a predetermined region close to a microwave transmission line on a surface of a high-frequency integrated circuit (MMIC) 10 is selectively etched to form a recess (pit). Thereafter, a dielectric which functions as a resonator is embedded in the pit by using, for example, a sol-gel method. It is heat-treated, as needed, to crystallize the dielectric. Thus, a dielectric resonator 18 is formed, so as to magnetic field couple a microwave transmission line 17.
| JPH02134879 | PACKAGE STRUCTURE OF LIGHT EMITTING DIODE |
| JP4330411 | Circuit equipment |
YAMASHITA YOHACHI
YOSHIHARA KUNIO
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