To provide a high frequency multilayer circuit board provided with a cancelling means which is simply structured and exhibits a high manufacturing operability for cancelling parasitic capacity caused by provision of conductive pattern layers.
The high frequency multilayer circuit board 20 has several conductive pattern layers which are stacked through the intermediary of insulating layers. Electrically conductive connection is established at the multilayer board provided with several main conductive through-holes 27-29, and the several main conductive through-holes 27-29 is provided through arbitrary several stages from the uppermost conductive pattern layer 21a to the lowermost conductive pattern layer 21h on their circumference surfaces. Several ground conductive through-holes 30a-30g, 31a-31g and 32a-32g are scattered on circumferences of circles with required radiuses from axial centers of the several main conductive through-holes. The radiuses for the several ground conductive through-holes are set larger in proportion to the number of conductive connection stages between the several main conductive through holes and the several conductive pattern layers.
SUZUKI RYOTA
TANABE MASAHIRO
KUMAMOTO TAKESHI
YAMASHITA YUSUKE
Shunguchi Sekiguchi
Akio Saruwatari
Junichi Furukawa