To make compact a light emitting diode or an electronic component such as a light emitting diode package, and to manufacture it at a high integration density or in various shapes.
In a method for manufacturing an electronic component such as a light emitting diode package having a reflecting surface outside of a light emitting diode element mounted on the surface of a ceramic substrate; a paste ceramic material is printed on the surface of the baked ceramic substrate, and then the past ceramic material is sintered to thereby form raised portions on the surface of the ceramic substrate. In particular, by repeating the printing of the paste ceramic material and the sintering thereof by a predetermined number of times, a plurality of laminated ceramic layers are formed on the surface of the ceramic substrate. When the printing of the paste ceramic material and the sintering thereof are repeated by a predetermined number of times, the widths of the paste ceramic material to be printed are sequentially made narrower.
FUKAE HIROYUKI
YAMAMOTO NARIMIYA
KUDO KOJI
FUKUMOTO SHIGEO
NISHIYAMA KENGO
| JPH09298313A | 1997-11-18 | |||
| JP2004259898A | 2004-09-16 | |||
| JP2005136019A | 2005-05-26 | |||
| JP2005210043A | 2005-08-04 | |||
| JPH0677540A | 1994-03-18 | |||
| JP2005191044A | 2005-07-14 | |||
| JP2003217968A | 2003-07-31 | |||
| JP2000332140A | 2000-11-30 | |||
| JP2005533172A | 2005-11-04 | |||
| JP2004122490A | 2004-04-22 | |||
| JP2004168610A | 2004-06-17 |
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